Présentation
Micro Systems Engineering is the leading manufacturer of complex LTCC substrates and offers a great variety of advanced assembly and semiconductor packaging processes as well as EMS. For more than 30 years MSE manufactures sophisticated electronic modules for various applications.

MSE covers the full range from design support over substrate manufacturing to advanced assembly and packaging out of one hand at the highest quality level. MSE offers solutions for high frequency packages, sensors packages, multi-chip modules and high reliability substrates and modules in avionic-, space-, radar-, automotive- and sensor applications.

MSE is an MST company. www.mst.com/msegmbh


Produits présentés
MSE provides a broad variety of processes like wire bond, die attach and flip chip, CSP and standard SMT processes using solder or adhesives as well as very special, partially proprietary packaging technologies. MSE also offers transfer molded BGA packages, including die stacking.
LTCC standing for Low Temperature Co-fired Ceramics is a multilayer ceramic technology for high reliability, HF and hermetic packaging solutions.