20 & 21 mars 2019
Paris Expo - Porte de Versailles - Hall 5.3
Radiofréquences, Hyperfréquences, Wireless, CEM et Fibre Optique
Demande d'infos pour exposer
Demande de badge visiteur
Télécharger l'invitation
Visionner les vidéos 2018
Exposants & partenaires 2018
Logo & Bannières 2018
Informations Pratiques
Exposants et Conférences
Sylvie Cohen: Commissaire général
Ligne directe: +33 (0)1 44 39 85 16
Email: s.cohen@infoexpo.fr
Marie-Christine Flahault: Relations Presse
Ligne directe: +33 (0)6 15 37 18 11
Email: flahault@orange.fr
chairman: Mr Michel SCHALLER -Thales Airborne Systems– Gixel
5 avril 2012

10:00 to 10:40 am: State of the art of microelectronic technologies within constrained environments.
M. Alain Dravet: microelectronics expert, Thales Airborne Systems.

Management of reporting and assembly technologies remains a fundamental concern for microelectronics in particular when the material environments involved are at the very limits of the physically possible. At the same time that hyperfrequency and radiofrequency functions are being densified, there is a constant need for innovation and improvement in competitiveness that is actually leading engineers in the sector to consider the supply chain even at the development phase (introduction to the next presentation).

10:45 to 11:35 a.m: Example of a national development and production supply chain for RF & Hyperfrequencies.
Mr Georges Peyresoubes, Thales Microelectronics

The major instructing parties in the aeronautics, telecommunications, defence and spatial sectors rely heavily on a network of partners and subcontractors to create their complex materials. These ecosystems, already up and running in production contexts, sometimes seek improvements in productivity and responsiveness for the development phases. This presentation illustrates developments in this area.

11:40 to 12:10 p.m: Latest developments in 3D microelectronic assembly technologies.
Mr Christian Val - CEO of 3D Plus

Thinner and lighter but with greater memory, power, autonomy, functionalities and all at an affordable price: these are the constraints of modern electronics that dictate how we make and will continue to make our Smartphones, tablets and the new products of today and tomorrow. Christian Val, pioneer of 3D inter-connection of electronic microchips explains the state of the art and perspectives for 3D integration of microelectronics.

retour à la liste
Partenaires Medias
www.microwave-rf.com - copyright BIRP - Groupe Solutions 2018 - 15 rue de l'Abbé Grégoire 75006 Paris
tous droits réservés - Privacy policy